BondTech BMG-HT for FUNMAT HT
The ultimate upgrade for the Intamsys Funmat HT
- High-Temp Upgrade Kit
- Lower weight
- Significant printing improvement
Product information & technical details
High temperature extruder
The BMG-HT for the Intamsys Funmat HT is a high-temperature upgrade kit based on the popular Bondtech Mini Geared (BMG) extruder. It has a milled aluminium housing and a high-temperature pancake stepper motor that can withstand temperatures in the build chamber of up to 150 ° C.
Increase the value of your Intamsys FunMat HT with this upgrade. Your 3D printer is more reliable and less susceptible to slipping and grinding of the filament. Avoid the usual extrusion problems by equipping your high-temperature 3D printer with the state-of-the-art dual-drive system.
Lower weight for more power
By using our 3: 1 gear ratio, BondTech has increased available thrust and resolution, even though a pancake high-temperature stepper motor is used. The lightweight stepper motor and aluminium housing reduce the total weight of the printhead. Comparing the parts exchanged and added in this setup for the Intamsys Funmat HT, we reduced the weight load from over 400g to less than 260g. A weight saving of over 35%, which has a positive effect on the performance of the printer.
- Less wear of linear motion systems
- Better surface quality
- Faster 3D printing
Here you will find the installation instructions .
Did you know?
Since March 2017, a 3D printer has been stationed on the ISS space station.